Semiconductor Materials
Bisphenol Polyol Dissolution Modifier
SCP-RA-307Multifunctional phenolic polyolElectronic Grade (High Purity)
Multifunctional phenolic additive for dissolution-rate control and sensitivity enhancement in novolak and chemically amplified systems. Also serves as a rigid polyol core for epoxy and cyanate-ester networks.
Key applications
- Dissolution-rate control
- Sensitivity enhancement
- Epoxy network cores
Specifications
- Product Code
- SCP-RA-307
- Chemistry Class
- Multifunctional phenolic polyol
- Product Family
- Photoresist Additives
- Product Line
- Semiconductor Materials
- Grade
- Electronic Grade (High Purity)
Specifications are indicative. Full Certificate of Analysis and Safety Data Sheet are provided with every order.
Documentation provided
Certificate of Analysis (COA)Safety Data Sheet (SDS)Technical InformationBatch Traceability
More in Semiconductor Materials
View allPhotoresist Monomers
Fluorinated Tertiary-Alcohol Methacrylate
SCP-RM-101
- Chemistry Class
- Hexafluoroalcohol (HFA)-functional methacrylate
- Key Applications
- ArF / EUV photoresist polymersLow-k dielectric materialsHigh-transparency resist design
Electronic Grade (Low Metal Ion)
Photoresist Monomers
Cyclic-Sulfonate Polar Methacrylate
SCP-RM-102
- Chemistry Class
- Oxathia-bicyclic sultone methacrylate
- Key Applications
- Chemically amplified resists (CAR)Adhesion & dissolution controlEtch-resistant resist matrices
Electronic Grade (Low Metal Ion)
Photoresist Monomers
Norbornane Fluoroalcohol Methacrylate I
SCP-RM-103
- Chemistry Class
- HFA-norbornyl methacrylate (compact tether)
- Key Applications
- ArF immersion lithographyEUV resist platformsLow line-edge-roughness (LER) design
Electronic Grade (Low Metal Ion)