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SucopeiaSemicon Solutions

Monomers, crosslinkers and intermediates for reliable encapsulation.

Advanced Packaging Materials

High-performance monomers, crosslinkers, epoxy systems and coupling agents for advanced semiconductor packaging — enabling robust encapsulation, adhesion and moisture resistance.

High purityExcellent adhesion & durabilityThermal & moisture resistanceEnabling advanced packaging

6 products

Packaging
SCP-AP-301

Reactive Styrenic Intermediate

Functionalised styrenic monomer (isomer blend)
Epoxy resinsPackaging intermediates
SCP-AP-302

Para-Selective Styrenic Monomer

Functionalised styrenic monomer (single isomer)
Resin modificationHigh-Tg materials
SCP-AP-303

Difunctional Aromatic Crosslinker

Divinyl aromatic monomer
Crosslinking agentsMolding compounds
SCP-AP-304

Trifunctional Epoxy Crosslinker

Heterocyclic triepoxide
High functionalityEncapsulation materials
SCP-AP-305

Multifunctional Epoxy Resin

Novolac-type epoxy
Semiconductor encapsulationHigh reliability
SCP-AP-306

Epoxy-Functional Silane

Alkoxysilane coupling agent
Adhesion promotionMoisture resistance
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Need something beyond our Packaging line?

We synthesise to specification and scale from samples to commercial supply. Share your requirements and our technical team will respond.

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