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Reactive resin monomers, crosslinkers and polyimide building blocks for heterogeneous integration.

Advanced Packaging Materials

Reactive styrenic monomers, high-functionality crosslinkers and photosensitive-polyimide dianhydrides supporting fan-out packaging, redistribution layers and flip-chip reliability — engineered for adhesion, low warpage and thermal endurance.

High purityAdhesion & reliabilityLow-warpage networksPSPI-ready building blocks
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