Reactive resin monomers, crosslinkers and polyimide building blocks for heterogeneous integration.
Advanced Packaging Materials
Reactive styrenic monomers, high-functionality crosslinkers and photosensitive-polyimide dianhydrides supporting fan-out packaging, redistribution layers and flip-chip reliability — engineered for adhesion, low warpage and thermal endurance.
High purityAdhesion & reliabilityLow-warpage networksPSPI-ready building blocks
Packaging Resin Monomers
4 productsCrosslinkers
2 productsStart a conversation
Need something beyond our Packaging line?
We synthesise to specification and scale from samples to commercial supply. Share your requirements and our technical team will respond.

