Advanced Packaging Materials
Ether-Linked Aromatic Dianhydride
SCP-PI-521Bisphenol-ether bis(phthalic anhydride)Electronic Grade (Polymerisation-Ready)
Flexible-backbone dianhydride for photosensitive polyimide (PSPI) and low-k dielectric layers. Imparts low modulus, low moisture uptake and excellent adhesion in redistribution layers and flexible display substrates.
Key applications
- PSPI / polyimide synthesis
- Redistribution layers (RDL)
- Flexible display substrates
Specifications
- Product Code
- SCP-PI-521
- Chemistry Class
- Bisphenol-ether bis(phthalic anhydride)
- Product Family
- Polyimide & PSPI Materials
- Product Line
- Advanced Packaging Materials
- Grade
- Electronic Grade (Polymerisation-Ready)
Specifications are indicative. Full Certificate of Analysis and Safety Data Sheet are provided with every order.
Documentation provided
Certificate of Analysis (COA)Safety Data Sheet (SDS)Technical InformationBatch Traceability
More in Advanced Packaging Materials
View allPackaging Resin Monomers
Para-Functional Styrenic Monomer
SCP-PR-501
- Chemistry Class
- Reactive benzylic-halide styrenic, single para isomer
- Key Applications
- High-Tg packaging resinsPost-functionalisable polymersMembrane & resist chemistry
Electronic Grade (High Purity)
Packaging Resin Monomers
Ortho-Functional Styrenic Monomer
SCP-PR-502
- Chemistry Class
- Reactive benzylic-halide styrenic, single ortho isomer
- Key Applications
- Specialty resin designSteric reactivity tuningPackaging polymers
Electronic Grade (High Purity)
Packaging Resin Monomers
Meta-Functional Styrenic Monomer
SCP-PR-503
- Chemistry Class
- Reactive benzylic-halide styrenic, single meta isomer
- Key Applications
- Encapsulant networksUniform cure kineticsUnderfill chemistry
Electronic Grade (High Purity)